Radxa eMMC Module

Radxa eMMC Module uses the eMMC 5.1 specification and offers four capacity options: 16G / 32G / 64G / 128G. At the same time, you can choose models that support industrial-grade long life. In addition, this module supports JEDEC's standard eMMC command set and is designed for high-speed read and write, making data transfer faster.

Read / write speed test

The eMMC chip we use is branded as Foresee, by Longsys, a Shenzhen embedded storage company, who acquired Lexar Brand in 2017.

Below is the test we did on different brand eMMC chips.

Capacity	Brand	Read	Write
8G	Sandisk	270MB/s	39.4MB/s
16G	Sandisk	230MB/s	79.6MB/s
16G	Kingston	160MB/s	50.1MB/s
16G	Foresee	189MB/s	74.4MB/s
16G	Foresee	241MB/s	79.5MB/s
32G	Sandisk	263MB/s	139MB/s
32G	Samsung	263MB/s	78.3MB/s
32G	Kingston	152MB/s	87.2MB/s
64G	Sandisk	207MB/s	100MB/s
64G	Foresee	215MB/s	148MB/s
64G	Foresee	194MB/s	148MB/s
128G	Toshiba	217MB/s	143MB/s

Specifications

• JEDEC Standard: v5.1
• B2B Connector specification: GB042-34S-H10 (socket-34pin) + GB042-30S-H10 (socket-30pin)
• Storage Options: 16G / 32G / 64G / 128G
• Compatibility: Compatible with ROCK 3A / 3B / 3C / 4A / 4B / 4C / 4C PLUS / 4D* / 4SE / 5A / 5B
• Dimension: 13mm x 18mm x 1.5mm

Note: Due to the pin multiplexing limitation, the ROCK 4D version with SPI Flash does not support the eMMC module.

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Pinout

GB042-34S-H10 (Socket - 34 pin)

Primarily used for signal transmission.

Signal	Pin	Pin	Signal
GND	1	18	GND
EMMC D5	2	19	GND
GND	3	20	VCC 1V8
EMMC D4	4	21	VCC 1V8
GND	5	22	VCC 3V3
EMMC D0	6	23	VCC 3V3
GND	7	24	GND
EMMC CLK	8	25	EMMC CMD
GND	9	26	GND
EMMC D3	10	27	EMMC D2
GND	11	28	GND
VCC 1V8	12	29	EMMC D1
GND	13	30	GND
GND	14	31	EMMC D7
EMMC STROBE	15	32	GND
GND	16	33	EMMC D6
GND	17	34	GND

GB042-30S-H10 (Socket - 30 pin)

Primarily used for mechanical fixation and support.