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Downloads

System Images

For Beginners

We strongly recommend that new users download the official Radxa OS GPT image and use the Balena Etcher tool to install it onto a microSD card. This is the simplest and quickest way to get started.

Image Type Descriptions

  • GPT System Image (Recommended for Beginners):

    • Compatible with microSD cards or NVMe SSDs
    • Uses the user-friendly Balena Etcher graphical tool
    • Supports dd command line flashing
    • Radxa's recommended image type with best compatibility
  • FEL System Image:

    • For flashing via FEL mode and Phoenix tools
    • Primarily used for onboard eMMC storage installation
    • Suitable for device recovery and mass production
    • Requires some technical knowledge

Debian Linux

A733 Unified System Image

Suitable for all A733 SoC products, such as Cubie A7Z, Cubie A7A, etc. Beta versions start with t, while official releases start with r.

Currently supports booting from microSD cards, eMMC modules, and UFS modules. NVMe/SSD boot requires flashing the SPI Nor Flash firmware.

Cubie A7Z Legacy Images

This page contains legacy system images for Cubie A7Z and is no longer updated.

Android

Compatible with microSD cards / UFS modules.

FEL System Image

Flashing Tools

SD Card Boot Disk Creation Tool:

PhoenixCard

System Flashing Tools:

PhoenixSuit (Windows)

LiveSuit (Linux)

Hardware Design

References Documentation

Tina5.0 AIoT Documentation

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Note: The Tina5.0 AIoT Documentation is primarily available in Chinese.

This documentation system provides comprehensive technical support for Allwinner A-series (A527, A733, etc.) and T-series (T527, etc.) chips. Deeply integrated with Tina5.0 AIoT documentation, it covers the entire product lifecycle from "Hardware Design → Software Development → Tool Adaptation → Mass Production." The primary target users include:

  1. Hardware Engineers: Supporting hardware solution design and implementation
  2. Linux/AIoT Software Developers: Adapting drivers and applications for Tina5.0 SDK
  3. Production Line Technicians: Addressing practical issues in mass production
  4. Compliance and Procurement Personnel: Accessing material compatibility and environmental certification information

Hardware Documentation

  • Bill of Materials (BOM)

    Defines the core material compatibility range, including supported components such as camera modules, LCD/eDP displays, Wi-Fi/BT modules, input sensors, DRAM, eMMC/NAND storage, etc. Provides selection guidance to ensure component compatibility.

  • Hardware Design Resources

    Offers reusable design templates and specifications, including reference schematics, motherboard/prototype schematics, PCB reference designs, design guidelines, and hardware checklists. Also includes IBIS models and PMIC selection guides to directly support hardware development.

  • Chip Manuals

    Provides core technical parameters, including datasheets, pinout definitions, user manuals, product briefs, and supplementary PMIC manuals for specific chips.

Software Documentation

  • SDK Module Development Guide

    Focuses on hardware interface driver development, featuring documentation for 20+ core modules including display, audio/video, storage and communication, high-performance modules, and system fundamentals. Helps developers quickly complete driver adaptation.

  • Basic Component Development Guide

    Simplifies application and system configuration, covering system deployment, multimedia and graphics, testing and tools, security, and heterogeneous computing to meet diverse AIoT scenario requirements.

Tools Documentation

Centered on "improving development efficiency and lowering the barrier to mass production," provides a tool ecosystem and practical guidelines.

Mass Production Documentation

Offers end-to-end solutions for common production line challenges.

  • Pre-Production Verification Guide: Includes material verification processes and pilot production stability checklists to help users preemptively address material compatibility and solution stability risks.

  • Production Line Troubleshooting Guide: Covers fault diagnosis steps for critical scenarios such as bootloader programming, MMC/eMMC storage, I/O interfaces, display, and security. Includes typical case studies and solutions to enhance production line issue resolution efficiency.

  • Mass Production Process Standards: Provides production guidelines for Allwinner T-series chips, ESD (Electrostatic Discharge) operation specifications, and defective product analysis procedures. Defines standard operations and compliance requirements for each production stage to ensure consistency and product yield.

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